| Sponsor |
|
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
|
|
|
Foresite is a consulting and analytical test laboratory dedicated to solving product reliability issues created when electronic manufacturing process residues and surface contaminants degrade field performance.
Foresite has created an extensive database of knowledge and experience in residue characterization methods, and uses this information to resolve electronics manufacturing problems.
|
|
Foresite, Inc.
|
Supplier Update Form
|
Use the form below to request updates to this supplier page listing.
|
|
