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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
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Finetech's high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications. Sub-micron placement is possible with an extensive range of bonding technologies; our quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Our professional SMD hot gas rework systems provide high end solutions. These products deliver the key benefits needed for reworking advanced devices.
The entire product development and production chain is accomplished internally (machine hardware, process modules, control electronics, tooling, software and more). This approach allows for short response times and high effectiveness at every step.
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Finetech
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