| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
New SELECT Synchro soldering system
A multi-station selective soldering system that uses a unique, synchronous motion to increase throughput, improve cost-of-ownership, and provide flexibility for electronics manufacturers.
Nordson Electronics Solutions
|
|
|
Finetech's high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications. Sub-micron placement is possible with an extensive range of bonding technologies; our quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Our professional SMD hot gas rework systems provide high end solutions. These products deliver the key benefits needed for reworking advanced devices.
The entire product development and production chain is accomplished internally (machine hardware, process modules, control electronics, tooling, software and more). This approach allows for short response times and high effectiveness at every step.
|
|
Finetech
|
Supplier Update Form
|
Use the form below to request updates to this supplier page listing.
|
|