Sponsor

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS

Sponsor

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika

Finetech's high‐accuracy bonding equipment for micro assembly supports the most precise and complex applications. Sub-micron placement is possible with an extensive range of bonding technologies; our quality optics and highly stable machine design provide the accuracy and repeatability that today’s applications demand. Our professional SMD hot gas rework systems provide high end solutions. These products deliver the key benefits needed for reworking advanced devices.

The entire product development and production chain is accomplished internally (machine hardware, process modules, control electronics, tooling, software and more). This approach allows for short response times and high effectiveness at every step.

Finetech

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Contact Information

540 West Iron Avenue #102
Mesa, AZ 85210

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