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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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The Asys Group provides EKRA screen printing solutions for the SMT, Hybrid, Semiconductor Packaging, and Solar industries. All EKRA products focus on "Useful Technology" that provides real benefit to customer processes and are characterized by their efficiency, ease-of-use, and reliability.
Greater throughput, up-time, and yield are guaranteed through standard features such as solid and open machine frame designs, closed loop print head control, high efficiency stencil wiping systems, and market leading vision and inspection capability.
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EKRA
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