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Sponsor
AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
DEK is the world's leading provider of equipment and processes for the high accuracy mass imaging of electronic materials. With print platforms to enable future-proofed production capability, stencil and screen technologies and unmatched expertise and customer support, DEK enables processes from mainstream SMT to semiconductor packaging to solar cell production.

* Award-winning screen printing platforms and technologies expertly supported with implementation and optimization assistance
* Field-retrofittable productivity tools including Cyclone understencil cleaning, HawkEye post-print inspection, Paste Roll Height Monitor, HD Grid-Lok automatic tooling support, ProFlow enclosed head printing and Stinger printer adaptable dispensing
* Global support, in-depth training and engineering expertise

DEK International

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Press Releases
Press releases are pulled from the database at Circuitnet. SUBMIT
Contact Information
1785 Winnetka Circle
Rolling Meadows, IL 60006
Phone: 847-368-1155
WEBSITE
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