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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Sponsor
Indium-Corporation

The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
For more than 30 years, CheckSum has been relied on by major electronics manufactures to deliver value by reducing test time and developing technologies that make board test more accurate and reliable. Our systems are well equipped to serve a wide variety of industries and we are proud to provide full-service solutions: test systems, fixtures, programs, and worldwide support.

CheckSum, LLC

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6108 188th St. NE Suite B800 Arlington, WA 98223 USA
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