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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Akrometrix manufactures, sells, and services equipment for thermal warpage & strain measurement and analysis on whole wafers, wafers on film frame (whole & diced), die on package, sockets, molded die in package, bare boards, substrates and die/package on pcb.
We also provide test services for thermal warpage and strain measurements. Headquartered in Atlanta, Georgia, USA and founded by a Georgia Tech Professor in 1994 we have over 250 systems installed in 20 countries around the world.
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Akrometrix, LLC
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