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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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One of the most innovative and strategic high-tech companies in the country, ARC integrates two main divisions: a MEMs level Thin Film Device Wafer Fab and a High Precision Engineering Machine Shop, into a unique combination of manufacturing and research operations. These two cores are augmented with electronics and automation skills.
ARC excels at both R&D and Manufacturing activities for a wide variety of customers and projects in the Semiconductor, Mil/Aero and Scientific Instrument Markets. Highly technical and difficult projects are ARC’s natural niche. We like having most of our engineering, process development and critical fabrication operations completely in-house, reducing the dependence on outside fabrication resources which vastly reduces cycle times.
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Advanced Research Corporation
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