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AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from design for manufacturing and process development of Multi-Chip Modules (MCM), 2.5D & 3D Heterogeneous Assembly, Chiplets, Chip-On-Board (COB), Chip-On-Flex (COF), PCBA and RF Assembly. AmTECH processes include, flip chip TCB & C4, silver sintering, die attach, wire bonding, ribbon bonding, dispense & encapsulation, and Surface Mount Technology (SMT).
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