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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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Circuit Design Specialties provides complete electronic and mechanical assembly services for industrial, military, and medical clients. Our friendly staff works closely with you and your business to assist you with new product development, prototyping, and large-scale production.
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Circuit Design Specialties, Inc.
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