JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes.
The system has been proven for Cu, PCC, Ag, Au bond wires, and for advanced package types like 3D, SiP WLCSP, BOAC, all without process-induced damage for reliability test and failure analysis.
|
|
