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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes.
The system has been proven for Cu, PCC, Ag, Au bond wires, and for advanced package types like 3D, SiP WLCSP, BOAC, all without process-induced damage for reliability test and failure analysis.
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JIACO Instruments
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