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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Microplex offers customer focused solutions for thru-via electronic products. Our primary technical capability is expertise in fabricating high temperature metallized vias.
Metallized vias can be processed in silicon glass, alumina, and quartz substrate materials. Metallized fine diameter vias (as small as 25 microns) can be achieved in both wafers and panels. Conductive metals commonly utilized within the vias are copper, silver, and gold.
Microplex supports prototype builds and moderate quantity volume production. All orders/projects are carefully co-engineered interactively with customers.
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Microplex, Inc.
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