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![Microplex, Inc. Logo]()
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Microplex offers customer focused solutions for thru-via electronic products. Our primary technical capability is expertise in fabricating high temperature metallized vias.
Metallized vias can be processed in silicon glass, alumina, and quartz substrate materials. Metallized fine diameter vias (as small as 25 microns) can be achieved in both wafers and panels. Conductive metals commonly utilized within the vias are copper, silver, and gold.
Microplex supports prototype builds and moderate quantity volume production. All orders/projects are carefully co-engineered interactively with customers.
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Microplex, Inc.
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