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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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![aveni S.A. Logo]()
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aveni enables future technologies with its innovative approach to metallization for semiconductor, MEMS, advanced packaging, and flex applications. aveni's processes Electrografting and Chemicalgrafting rely on molecular engineering to grow metallization films molecule by molecule. No space is too tight, no surface too rough for aveni. All this, and the processes can be implemented on industry-standard equipment.
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aveni S.A.
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