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Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
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ASM AMICRA Microtechnologies is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy. Our equipment offering supports: Die Attach and Flip Chip Bonding, High Speed Wafer Inking and Inspection, High Speed Dispense System and Custom Solutions.
Our market focus includes: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP, Automotive Sensors/LiDAR.
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AMICRA Microtechnologies GmbH
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