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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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![USTEK, Inc. Logo]()
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We provide alternative solutions to your day-to-day problems such as helping you cut costs for your current buy of a printed circuit board by spec'ing a more cost effective material. Or changing the processing method of a metal part to a less expensive alternative. Or trading off an incremental increase in cost for an order of magnitude increase in product performance and quality. Whatever your situation demands -- cost reduction, increased quality, greater profitability, faster time to market -- USTEK will supply.
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USTEK, Inc.
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