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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Quik-Pak, a division of Promex, provides IC packaging, assembly, and wafer preparation services in its facility in San Diego, California. Quik-Pak manufactures overmolded QFN/DFN packages and pre-molded air cavity QFN packages that provide a fast, convenient solution for prototype to full-production needs. Same-day assembly services are provided to shorten time to market.
Quik-Pak also provides high-volume IC assembly services utilizing its automated assembly and molding equipment for production runs in the 10,000s of units. In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, chip-on-board (COB) and chip-on-flex assemblies.
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QP Technologies
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