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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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ASM Assembly Systems is the supplier of SIPLACE, a leader in surface mount technology (SMT) equipment, software, and services to the electronics assembly market. The spectrum of our products and services include an award-winning innovative and flexible platform, customized solutions, logistics, information technology, planning and consulting, as well as customized around-the-clock service and maintenance support.
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ASM Assembly Systems
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