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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Manufacturers and designers of The Patented HIG (Harmonic Inductive Gain) induction heating systems, providing air and water cooled solutions for wire to connector, wire to PCB and component to PCB lead-free and leaded soldering applications.
iTherm's product line also includes coils and power supplies for medical device manufacturing, electronics assembly, precision heating, and custom solutions for clinical medical use for thermal therapies and material activations.
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iTherm Technologies
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