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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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Founded in 1958, Interplex Industries, Inc. is headquartered in College Point, NY. The company provides product design and application development services for complex modules and assemblies, metal etching, prototyping, tool design and build, precision metal stamping, die casting, precision machining, plating and finishing, insert and injection molding, assembly and full scale automation services around the world.
Interplex currently provides its services to the communications, electronics, industrial, medical and automotive markets and has facilities in the United States, Mexico, China, Singapore, India, Malaysia, Korea, Scotland, France, Germany and Hungary.
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Interplex Industries Inc.
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