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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Founded in 1985, Advanced Techniques US Inc. (ATCO) designs and manufacturers precision equipment for assembly, soldering, rework, and testing of PCBs and hybrid microelectronics. Our products consist of SMD / BGA Rework Stations, SMT Reflow Ovens SMT Pick & Place Systems, Flip Chip & Die Bonders, and reflow simulators for JEDEC reflow and IPC D coupon testing applications.
We work closely with both existing and potential customers to fully understand, identify, and solve application requirements. No two companies are the same and even a typical application varies between customers. Rather than offering a cookie cutter solution, our goal is to take a personalized approach that involves technical discussions, hands-on application evaluation and demonstrations.
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Advanced Techniques US Inc.
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