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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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![PWB Interconnect Solutions Inc. Logo]()
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PWB Interconnect Solutions Inc. is the manufacturer of IST test equipment, provider of IST test services and source of reliability training and consultancy to PWB level segments of the electronics industry.
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PWB Interconnect Solutions Inc.
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