Hermetric, Inc.

Sponsor

Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK

Sponsor

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

Hermetric Inc. specializes in low impedance Resistance Weld sealing of electronic and semiconductor packages. This patented technology eliminates expulsion of particulates that cause reliability concerns when components are sealed using conventional resistance welding technologies. Package perimeters in excess of 6.0 linear inches can easily be sealed with this technology. You can forget about getters and similar devices required to pass PIND tests. Low impedance single shot resistance welding can hermetically seal hundreds of parts per hour.

Hermetric, Inc.

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Contact Information

PO Box 190
Burlington, MA 01803

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