circuit insight
Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Sponsor
BEST-Inc.

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
Reactive NanoTechnologies, Inc. was founded in 2001 to develop and manufacture its patented technology, NanoFoil®. NanoFoil® is used to precisely control the instantaneous release of heat energy for advanced joining applications providing superior performance and value to the user.

The company has also developed its patented NanoBond® joining process to simplify manufacturing and ensure the benefits of NanoFoil® are maximized. NanoBond® is used today to bond sputter targets and in several electronics assembly applications including LED assembly and thermal management.

Reactive NanoTechnologies, Inc.

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