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Want High-Quality BGA Reballing?
BGA rework and reballing solutions for commercial, military and aerospace perfected over 20-plus years of reliable, repeatable and proven success.
BEST Inc.
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AI Technology has more than 29 years experience in designing and manufacturing various forms of high performance “Stress-free” flexible adhesive films and pastes and materials for microelectronic packaging and thermal interface materials for thermal management applications.
Our technologies and products include solvent-free dies and substrate attach pastes and films, compressible gap-filling phase change thermal interface materials of thermal pads, thermal gels, thermal greases, polymer based Solder-Sub® flexible conductive adhesives for solder-replacement in fine-pitch interconnections, near-hermetic lid sealant for ceramic and metal covers and optical glass lids for opto-electronic sensors and devices, EMI Shielding gasket/adhesive/caulk materials, double-sided UV-release wafer grinding tapes and high temperature-static free dicing tapes.
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AI Technology, Inc.
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