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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Ascentech, LLC the North American Distributor for GEN3 Systems, also supplies the industry with other product reliability test equipment including the MUST III -Solderability test systems (wetting balance), Auto-SIR Surface Insulation Resistance test, CM-Series - Cleanliness test (ionic contamination), and the SPA-1000-Solder Paste Analyzer.
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Ascentech LLC - GEN3
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