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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Endicott Interconnect Technologies, Inc. (EI) is a world class supplier of electronic interconnect solutions and electro/mechanical equipment. As a successor to IBM's microelectronics division in Endicott, NY, we have over 45 years of experience in providing microelectronics solutions and we bring to market a unique mix of leading edge technology and technical know-how to provide customers with a time-to-market advantage.
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Endicott Interconnect Technologies, Inc.
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