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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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Solderstar is one of the world’s leading thermal profiling solution providers, with over a decade of specialising in the design, development and manufacture of profiling systems within the electronics manufacturing industry.
Our range of products satisfies all of today’s thermal process control needs, from full-feature high performance product profiling for reflow, wave, vapour and selective solder processes, to fully integrated SPC capabilities for continuous quality and process control.
Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world.
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Solderstar LLC
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