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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK
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Solderstar is one of the world’s leading thermal profiling solution providers, with over a decade of specialising in the design, development and manufacture of profiling systems within the electronics manufacturing industry.
Our range of products satisfies all of today’s thermal process control needs, from full-feature high performance product profiling for reflow, wave, vapour and selective solder processes, to fully integrated SPC capabilities for continuous quality and process control.
Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world.
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Solderstar LLC
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