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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Solderstar is one of the world’s leading thermal profiling solution providers, with over a decade of specialising in the design, development and manufacture of profiling systems within the electronics manufacturing industry.
Our range of products satisfies all of today’s thermal process control needs, from full-feature high performance product profiling for reflow, wave, vapour and selective solder processes, to fully integrated SPC capabilities for continuous quality and process control.
Products are available individually or in packages that are tailor-made to suit the technical and budgetary requirements of all electronics manufacturers, whatever their size and needs and wherever they are in the world.
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Solderstar LLC
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