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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, lead tinning, and component test equipment for electronics and component manufacturing, assembly, and distribution.
Hentec/RPS has been advancing automated lead finish and soldering technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90's. All Hentec/RPS products are designed and manufactured in Newman Lake, WA.
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Hentec Industries, Inc. / RPS Automation, LLC.
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