circuit insight
Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Sponsor
Master-Bond

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, lead tinning, and component test equipment for electronics and component manufacturing, assembly, and distribution.

Hentec/RPS has been advancing automated lead finish and soldering technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90's. All Hentec/RPS products are designed and manufactured in Newman Lake, WA.

Hentec Industries, Inc. / RPS Automation, LLC.

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Contact Information
25517 E Kildea Rd
Newman Lake, WA 99025
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