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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Phoenix Contact is a worldwide leader in the development and manufacturing of electrical connection, electronic interface and industrial automation technologies.
Phoenix Contact is a leading developer and manufacturer of industrial electrical and electronic technology.
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Phoenix Contact
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