circuit insight
Sponsor
Alltemated

Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
IDC was organized in 2002 to address the critical problem of drying electronic package piece-parts and components. We are a team of seasoned Senior Staff Engineers specializing in process development, mechanical design and automation control.

Several IDC senior engineers come from firms that are focused on drying processes for foodstuffs, pharmaceuticals and precision plated parts. IDC designs stress reliability and ease of operation.

Innovative Drying Company, LLC

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