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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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IDC was organized in 2002 to address the critical problem of drying electronic package piece-parts and components. We are a team of seasoned Senior Staff Engineers specializing in process development, mechanical design and automation control.
Several IDC senior engineers come from firms that are focused on drying processes for foodstuffs, pharmaceuticals and precision plated parts. IDC designs stress reliability and ease of operation.
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Innovative Drying Company, LLC
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