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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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IDC was organized in 2002 to address the critical problem of drying electronic package piece-parts and components. We are a team of seasoned Senior Staff Engineers specializing in process development, mechanical design and automation control.
Several IDC senior engineers come from firms that are focused on drying processes for foodstuffs, pharmaceuticals and precision plated parts. IDC designs stress reliability and ease of operation.
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Innovative Drying Company, LLC
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