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Get the Revisiting Underfill Handbook
Today's underfill applications are constantly evolving. As chip populations increase, dispensing applications must deliver smaller amounts of fluid with precision. Read this handbook.
Nordson Electronics Solutions
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IDC was organized in 2002 to address the critical problem of drying electronic package piece-parts and components. We are a team of seasoned Senior Staff Engineers specializing in process development, mechanical design and automation control.
Several IDC senior engineers come from firms that are focused on drying processes for foodstuffs, pharmaceuticals and precision plated parts. IDC designs stress reliability and ease of operation.
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Innovative Drying Company, LLC
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