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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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IDC was organized in 2002 to address the critical problem of drying electronic package piece-parts and components. We are a team of seasoned Senior Staff Engineers specializing in process development, mechanical design and automation control.
Several IDC senior engineers come from firms that are focused on drying processes for foodstuffs, pharmaceuticals and precision plated parts. IDC designs stress reliability and ease of operation.
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Innovative Drying Company, LLC
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