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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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FCT Assembly consists of several divisions:
* FCT Solder - A leader in Lead Free Solder Products
* Fine Line Stencil - Your Partner in Technology
* A-Laser - Custom Laser Cutting Services
* FCT Recovery - Dross Recycling and Metals Recovery
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
At FCT Assembly, we set ourselves apart from our competitors by continuously studying new products and processes in order to uphold our reputation as a leader in technology.
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FCT Assembly
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