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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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FCT Assembly consists of several divisions:
* FCT Solder - A leader in Lead Free Solder Products
* Fine Line Stencil - Your Partner in Technology
* A-Laser - Custom Laser Cutting Services
* FCT Recovery - Dross Recycling and Metals Recovery
With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.
At FCT Assembly, we set ourselves apart from our competitors by continuously studying new products and processes in order to uphold our reputation as a leader in technology.
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FCT Assembly
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