| Sponsor |
|
PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
|
|
| Sponsor |
|
5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
|
|
|
In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations.
Our commitment to leadership and quality in wafer bumping solutions continues, ensuring that FlipChip remains the leader in developing, and bringing to market the latest in bumping technology. The primary bumping facility and technology development site for FlipChip is located in the World Headquarters building in Phoenix, Arizona, USA.
|
|
Flip Chip International
|
|