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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Boschman Technologies manufactures automatic transfer molding systems for the semiconductor industry. Our patented Film Assisted Molding (FAM) technology is used to mold devices with exposed contacts, heat sinks, or chip surfaces, LLP and QFN packages and various sensors and MEMS.
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Boschman Technologies B.V.
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