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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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InsulFab PCB Tooling provides the highest quality custom tooling for all your process needs. We can assist in process improvement for every application including, SMT, wave, conformal coat, depaneling, press fit, vacuum and hand solder.
We offer the quickest delivery times in the industry with 2 locations to better serve your needs. We are certified with both ISO and ITAR to assure your quality and security.
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Insulfab PCB Tooling
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