| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
|
|
|
Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small to medium volume PCB assembly in the electronics industry.
STI also produces a complete line of solder training kits and training support products as well as distributes over 150 electronics and industrial product lines.
|
|
STI Electronics, Inc.
|
|