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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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Ormet materials provide high electrical and thermal conductivity, good solderability, adhesion to most substrates and low curing temperatures. During cure, Ormet ink becomes a fused metal network that alloys itself to conventional circuit materials.
The metal network is permeated by polymer that adheres to the substrate providing mechanical reinforcement. These properties represent the product of Ormet inks patented composition.
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Ormet Circuits, Inc.
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