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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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North Texas Circuit Board (NTCB) has over 33 years experience in manufacturing high reliability printed circuit boards at competitive prices and lead-times to support your quick-turn NPI & prototype needs as well as small to medium production runs. NTCB specializes in quick-turn for the aerospace, defense, semiconductor test (ATE) and electronic manufacturing services markets.
MIL-PRF-55110 certified for GF (FR4) and GI (Polyimide) materials. Also build a variety of substrates from BT Epoxy, Cynate Ester and high speed Rogers and Taconic materials. Rigid, Flex & Rigid-Flex product up to 32 layers including blind & buried vias and bonded heatsink assemblies.
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North Texas Circuit Board Inc.
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