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Research & Technical Papers
Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys
This paper investigates a number of low (or no) Silver ...
Tin Whisker Testing and Modeling
The elimination of lead from consumer electronics has resulted in ...
Microstructure and Reliability of Low AG/Bi Solder Alloys
The goal of this study was to provide a screening ...
NASA DOD SAC305/SN100C Copper Dissolution Testing
In lead-free solder alloys, the reaction of the tin/copper is ...
Lead-Free Selective Solder Guidelines
A study is conducted with a thick, thermally challenging test ...
Assembly of Fine Pitch PoP Components
Paper focuses on assembly variations for PoP components with .4 ...
Lead-free Development in Server Applications
Paper examines the effects of varying surface finishes, process parameters ...
High Complexity Lead-Free Wave and Rework
Paper focuses on the outcome of a program designed to ...
Reactions of Sn in the Cu-Sn-Zn Alloy
This paper reports a number of experimentally determined reactions that ...
Does Copper Dissolution Impact Reliability?
Results from this paper indicate concerns when severe copper dissolution ...
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A leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from the drawing board to full-scale production and after-market services.
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