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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Since its inception, YESTech has been a consistent innovator in the electronic inspection industry. Founded and managed by a team of industry experts with a history of success, we bring the most powerful, cost-effective yield enhancement solutions to theelectronics market.
YESTech's pioneering vision continues to develop and produce high-quality inspection systems that address our customers' ever-evolving needs.
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Nordson YESTECH
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