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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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X-Line Asset Management is the leading provider of worldwide asset disposition services with a specialized team made up of electronic assembly equipment experts. Learn more about how our platform has helped some of the world's top manufacturers achieve better results.
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X-Line Asset Management
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