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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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X-Line Asset Management is the leading provider of worldwide asset disposition services with a specialized team made up of electronic assembly equipment experts. Learn more about how our platform has helped some of the world's top manufacturers achieve better results.
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X-Line Asset Management
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