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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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With 30 years experience in the SMT and Through Hole Equipment Business, we pride ourselves on being your premiere equipment and consumables supplier. The original used equipment brokers dealing in Through Hole and SMT Equipment.
SMT Sales, LLC. has locations in New York, Texas, Mexico, India, with connections all over the world.
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SMT Sales, LLC
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