| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
|
|
Our ongoing goal is to assist our customers to achieve the best possible time to market and competitive advantage by producing printed circuit boards in a sustainable way at the lowest total cost through our competence, delivery accuracy and product quality.
|
|
NCAB Group USA
|
|
