| Sponsor |
|
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
|
|
|
Nordson MARCH is the global leader in advanced plasma surface treatment systems for the Semiconductor, Printed Circuit Board, Life Science, Hard Disk Drive, LED, and Solar / Photovoltaic industries.
We design and manufacture a complete line of plasma cleaning equipment, and maintain an expert staff of scientists and engineers focused on plasma cleaning.
|
|
Nordson MARCH
|
|
