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Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates.
Master Bond
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Landrex is one of the leading manufacturers in Asia for MDA, ICT, and functional test fixtures for users of automated test systems from companies such as Teradyne, GenRad, Agilent, TRI, JET, Tescon, Okano, Hioki and Schull.
Landrex also builds customized functional test fixtures for all types of functional test applications including RF testing.
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Landrex Technologies Inc.
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