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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic
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Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces. Our products include an array of basic and high-tech attachment materials including traditional soldering chemicals, paste, wire and bar products. We serve a worldwide customer base with facilities in North America, Europe and Asia.
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Kester
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