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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Essemtec, part of Nano Dimension, is a Swiss technology company with global presence founded in 1991. Essemtec develops, manufactures and provides high-tech solutions for the worldwide electronics manufacturing sector. Essemtec leads the industry in adaptive SMT pick-and-place equipment for both high-speed- and micro-dispensing, offering as well intelligent storage system to optimize the production operational flow.
Essemtec's solutions are unique and allow straightforward adaptions to meet customers' fast changing requirements. The combination of printed circuit board (PCB) placement accuracy, speed, and high-quality engineering makes the offerings unique. Equipped with latest technology, Essemtec products allow easy programming and operation for a wide range of applications.
Our Focus – Your Solution
Wildlife consistently shows us how nature can adapt and develop solutions according to its environment - that is what inspires us! Our product portfolio comprises production equipment for electronics assembly and more.
Our high-tech solutions can be adjusted quickly and easily to meet a wide range of requirements. We are able to respond to various customer requests and create together unique solutions.
We continuously invest in R&D and collaborative partnerships to develop outstanding solutions for our worldwide customers.
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Essemtec AG
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