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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Nordson EFD LLC (formerly known as EFD, Inc.) is a leading manufacturer of high quality solder pastes & fluxes and precision dispensing systems. Nordson EFD Solder is ISO9001 certified and offers a comprehensive line of printing and dispensing solder pastes for improving yields and reducing costs in assembly processes.
We provide application based solder products, complete paste dispensing solutions and develop supportive technical partnerships with our customers. Nordson EFD precision dispensing systems apply controlled amounts of solder pastes and fluxes, adhesives, sealants, lubricants and virtually any assembly fluid used in nearly every industrial manufacturing process.
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Nordson EFD LLC
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