| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
|
|
|
We are the world's leading company for temperature profiling in hostile thermal environments. To become the leader, Datapaq has produced, and will continue to produce, systems that are the most durable, accurate, and easiest to use in the world. No one combines highly accurate data loggers, rugged thermal barriers and analytical software better. A Datapaq system offers unsurpassed value.
Founded in 1984, Datapaq introduced its first product in 1985. We are now the industry leader for temperature measurement and analysis systems. Our goal was, and still is, to provide every manufacturing company key information on the effectiveness of their continuous, semi-continuous and batch ovens, kilns and furnaces.
|
|
Datapaq, Inc.
|
| Contact Information |
Europe/Africa/Asia/Australia
Datapaq Ltd.
160 Cowley Road
Cambridge, CB4 0GU
United Kingdom
North/South America
Datapaq, Inc.
187 Ballardvale Street
Wilmington, MA 01887 USA
|
|
WEBSITE
|
|
UPDATE THIS LISTING
|
|
|
|