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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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We are the world's leading company for temperature profiling in hostile thermal environments. To become the leader, Datapaq has produced, and will continue to produce, systems that are the most durable, accurate, and easiest to use in the world. No one combines highly accurate data loggers, rugged thermal barriers and analytical software better. A Datapaq system offers unsurpassed value.
Founded in 1984, Datapaq introduced its first product in 1985. We are now the industry leader for temperature measurement and analysis systems. Our goal was, and still is, to provide every manufacturing company key information on the effectiveness of their continuous, semi-continuous and batch ovens, kilns and furnaces.
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Datapaq, Inc.
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| Contact Information |
Europe/Africa/Asia/Australia
Datapaq Ltd.
160 Cowley Road
Cambridge, CB4 0GU
United Kingdom
North/South America
Datapaq, Inc.
187 Ballardvale Street
Wilmington, MA 01887 USA
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WEBSITE
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