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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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Nordson DAGE's award winning X-ray systems have been specifically and ergonomically designed for Printed Circuit Board assembly (PCB) and semiconductor industries not only within failure analysis laboratories but also within the production environment.
Nordson DAGE's winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond testing technology including a hot bump pull test in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies.
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Nordson Test & Inspection (previously Nordson DAGE)
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