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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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For the last 20 years, Cogiscan has created TTC solutions to help electronics manufacturers improve productivity, reduce waste, and in doing so, leverage higher margins. Offering leading machine and systems connectivity solutions is our way to ensure that you remain future-proof through this fast-paced, ever-changing industry.
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Cogiscan Inc.
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