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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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Since its foundation in 1996, CeTaQ GmbH has been a sought-after supplier of surface mounting capability studies (SMT). Since then, we have focused on analyzing and optimizing the quality capability of your production processes. All necessary measuring methods and software solutions are developed and produced in our company. This enables us to react flexibly and quickly to your requirements and wishes.
With our extensive wealth of experience of thousands of tested equipment from different manufacturers and types, we see ourselves as an independent and competent partner of electronics manufacturers and equipment manufacturers.
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CeTaQ Americas
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